发明名称 |
Integrated circuit package system for stackable devices and method for manufacturing thereof |
摘要 |
A method for manufacturing an integrated circuit package system includes: forming a stack module including: providing a stack die and encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die; mounting the stack module on a package base; connecting the pad to the package base; mounting a top die on the protruding support; connecting the top die to the package base; and encapsulating the top die, the package base, and the stack module with a package encapsulant.
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申请公布号 |
US8368199(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US20100964644 |
申请日期 |
2010.12.09 |
申请人 |
STATS CHIPPAC LTD.;CHOW SENG GUAN;HUANG RUI;KUAN HEAP HOE |
发明人 |
CHOW SENG GUAN;HUANG RUI;KUAN HEAP HOE |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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