| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the occurrence of warpage of a semiconductor substrate such as a semiconductor wafer and to prevent reduction in sealing performance. <P>SOLUTION: One surface 112 of a semiconductor substrate 110 on which lower-layer wiring 17 is formed and a film material 120 are bonded via an adhesive layer 119, and a protective film 124 is formed on the other surface 113 of the semiconductor substrate 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
