| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve impedance matching of a signal path in a semiconductor device, a method for manufacturing the same, a wiring board, and an electronic apparatus. <P>SOLUTION: The semiconductor device includes: a wiring board 22; a semiconductor element 23 mounted on a first main surface 22a of the wiring board; a solder ball 36 for power supply or grounding, which is provided on a second main surface 22b of the wiring board; and a long conductive piece 35 for a signal, which is erected on the second main surface 22b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
