| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module for attaching a semiconductor light emitting element and a semiconductor light emitting element module which achieve good heat radiation and are not likely to cause short circuits even when conductive members such as heat sinks are disposed near the modules, and to provide a manufacturing method of the module for attaching the semiconductor light emitting element and a manufacturing method of the semiconductor light emitting element module. <P>SOLUTION: A module for attaching a semiconductor light emitting element includes: a conductor plate 17 having at least one connection surface 21A, 21B, 21C, 21D that may connect with a semiconductor light emitting element 80 formed on one surface and made of a metal; a pair of terminal parts 60, 64 separated from the connection surfaces and connectable so as to be electrically conducted with the connection surfaces; and surface insulation parts 35, 70 covering an entire surface of the conductor plate, excluding the connection surfaces, and made of resin materials. <P>COPYRIGHT: (C)2013,JPO&INPIT |
