发明名称 SOUNDPROOFING THERMAL INSULATION STRUCTURE AND SOUNDPROOFING THERMAL INSULATION MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a soundproofing thermal insulation structure which can effectively reduce an impact sound, improve walk feeling, and impart heat insulating performance, and which can be easily constructed, and to provide a soundproofing thermal insulation material. <P>SOLUTION: A soundproofing thermal insulation structure is constructed in such a manner that a surface material A is provided on a building frame B configuring a floor or wall of a structure, with a buffer material 1 being interposed between the surface material A and the building frame B. The buffer material 1 consists of a flexible foam resin molded body having a thermal conductivity of 0.02 to 0.04 W/m*K, and is formed of surface material contact parts 2 each in contact with the surface material A and disposed with a space left from the building frame B, building frame contact parts 3 each in contact with the building frame B and disposed with a space left from the surface material A, and connection parts 4 each connecting the surface material contact part 2 and the building frame contact part 3 to each other. The surface material contact parts and the building frame contact parts are alternately arranged in parallel on line, the thickness t of the connection part is equal to or less than that T of the surface material contact part and the building frame contact part, and the surface material A has a flexural rigidity of 0.5 to 30 N*m<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013023997(A) 申请公布日期 2013.02.04
申请号 JP20110162583 申请日期 2011.07.25
申请人 JSP CORP;YUKA SANSHO KENZAI KK 发明人 SUZUKI OSAMU;SHINOZAKI HIROKI
分类号 E04B1/82;E04B5/43 主分类号 E04B1/82
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