| 摘要 |
<P>PROBLEM TO BE SOLVED: To satisfy a need for achieving a heat dissipation module which exhibits excellent heat dissipation characteristics without damaging the electrical characteristics of electronic circuit components. <P>SOLUTION: A first connection member is attached to the back surface opposite from the mounting surface of a mounting base plate on which electronic circuit components are mounted. The first connection member is connected electrically with a first conductive film of the mounting base plate connected electrically with the electronic circuit components, and coupled thermally therewith. A heat dissipation member is coupled thermally with the first connection member, and dissipates the heat transmitted from the electronic circuit components to the first connection member. A resistor connects the first connection member to the ground potential. <P>COPYRIGHT: (C)2013,JPO&INPIT |
