| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a sensor device, wherein bonding wires connected to input/output terminals of a sensor chip can be protected by using a simple facility. <P>SOLUTION: Pads 42a-42f of a sensor chip 40 and pads 51a-51h of a circuit chip 50 which are assembled to the inside of a recess 23 in a step 2 and bonding pads 21a-21d are respectively connected electrically by bonding wires 61-69 in a third step. In a fourth step, a colloidal solution 80 in which electrically charged particles are dispersed in an organic solvent is injected into the recess 23 in such a manner that the bonding wires 61-69 are immersed in it. In a fifth step, a potential gradient is generated in the colloidal solution 80 by applying a prescribed voltage to the terminals 21, thereby attaching the electrically charged particles to the surfaces of the bonding wires 61-69 by electrophoresis and forming protection films 71-79. <P>COPYRIGHT: (C)2013,JPO&INPIT |
