CONDUCTIVE PASTE FOR ELECTRON BEAM HARDENING, AND MANUFACTURING METHOD OF CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste for electron beam hardening, etc. which are arranged so that the spreading of exudation produced in a conductive layer can be suppressed sufficiently when manufacturing a circuit board by continuous printing, and which allow the formation of a circuit board showing excellent hardness and bendability even in use under a high-temperature environment, and having a conductive layer with good adhesion to a plastic base material.

SOLUTION: The conductive paste for electron beam hardening comprises: conductive powder; a radical polymerizable composition; a plasticizer; and a dispersant. The plasticizer is blended in a proportion of 5-20 pts.mass with respect to 100 pts.mass of the radical polymerizable composition. The dispersant is a cation-base dispersant.

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