| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for processing a device wafer, for preventing occurrence of defective devices due to attachment of an adhesive. <P>SOLUTION: A method for processing a device wafer comprises the steps of: preparing a carrier wafer having a carrier excessive region in a position corresponding to a circumference excessive region of a device wafer; forming a concave portion in the carrier excessive region; thereafter, disposing an adhesive in the concave portion so as to be projected from a surface of the carrier wafer; thereafter, bonding a front face side of the carrier wafer and a front face side of the device wafer to fix the device wafer to the carrier wafer with the adhesive; and thereafter, grinding or polishing a back face side of the device wafer to thin the device wafer so as to have a predetermined thickness. <P>COPYRIGHT: (C)2013,JPO&INPIT |
