| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyurethane resin composition capable of providing a supporting pad which shows a high compression ratio and a high compression recovery ratio, is used in a process of polishing a substrate or glass used for a semiconductor device or a display, and can minimize a surface defect, roughness and waviness, and to provide the polyurethane supporting pad obtained from the resin composition. <P>SOLUTION: The polyurethane resin composition contains: a polyurethane resin containing a soft part containing a polyol residual group containing ethylene glycol and 1,4-butanediol, the ratio being specific, and a polycarboxylic acid residual group; and a hard part containing a specific amount of a polyisocyanate residual group and a chain extender residual group; an organic solvent; and a surfactant. The polyurethane supporting pad is formed of the resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
