| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve highly reliable high quality bonding by regulating vibration of an inner lead in the ultrasonic vibration direction, when using a high ultrasonic output for bonding a connection body, e.g., a conductive ribbon or a thick wire, to a lead frame, and to provide a manufacturing method of a semiconductor device. <P>SOLUTION: The semiconductor device includes a lead frame 4 having an inner lead 7a, a semiconductor element 2 mounted on the lead frame 4 and having an electrode pad 3a, and a conductive connection body 8 which connects the electrode pad 3a and the inner lead 7a. A recess 12 is arranged near the bonding region 11 of the inner lead 7a to which the connection body 8 is bonded. <P>COPYRIGHT: (C)2013,JPO&INPIT |
