| 发明名称 |
SUBSTRATE FOR THIN FILM DEVICE AND METHOD OF MANUFACTURING THIN FILM DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a thin film device having both adhesiveness and detachability, and a manufacturing method of the thin film device with a satisfactory yield. <P>SOLUTION: A substrate for a thin film device has a resin substrate disposed on a support substrate. A peeling adjustment layer is disposed entirely or partially on the support substrate so that an interface between a surface of the resin substrate closer to the support substrate and a surface contacted with the surface of the resin substrate has (A) a region with adhesiveness of not less than 0.03 MPa nor more than 0.12 MPa and (B) a region with adhesiveness of 0.14 MPa or more according to JISK5600-5-7. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013026546(A) |
申请公布日期 |
2013.02.04 |
| 申请号 |
JP20110161904 |
申请日期 |
2011.07.25 |
| 申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SASO NAOKI;OGAWA KENICHI;ARIHARA KEITA;SAKAYORI KATSUYA;FUKUDA TOSHIHARU |
| 分类号 |
H01L21/02;H01L21/336;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
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