| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a wiring pattern, which connects a pair of pads, in the same layer as the pads. CONSTITUTION: A printed circuit board(120) comprises solder resist residue(210), a solder resist removed part(220), pads(230), a ball shape distortion preventing pattern(240), and wiring(250). Solder resist is removed from a space between the pads that are electrically connected by the wiring. The wiring is formed out of the same material and in the same layer as the pads. A ball-shaped adhesive material is formed on the pads of the printed circuit board. |
