| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyphenylene ether resin composition excellent in heat resistance and flame retardancy of a cured product, while keeping an excellent dielectric characteristic of a polyphenylene ether. <P>SOLUTION: The polyphenylene ether resin composition contains a modified polyphenylene ether expressed by formula (1), and a thermal crosslinking type curing agent. In the formula (1), m represents 1 or 2; L represents a polyphenylene ether chain of prescribed structure; M represents a hydrogen atom, or a group of prescribed structure containing an unsaturated double bond and phosphorus, M is not hydrogen atom when m is 1, at least either of two Ms is not hydrogen atom when m is 2, and T represents hydrogen atom when m is 1, and represents an alkylene group, or a group of prescribed structure derived from a polyphenylene ether, when m is 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
