| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve uniformity of film thickness of a film formed on a substrate. <P>SOLUTION: A film formation apparatus includes a conveyor conveying a substrate 200 along a conveyance path, a deposition chamber 100 located in the conveyance path, and a heating furnace 120 located along the conveyance path in a form of a tunnel for surrounding and heating the substrate 200 passing through the deposition chamber 100. The deposition chamber 100 includes a case 150, a spray mechanism spraying deposition gas made by microparticulating deposition material into the case 150, and an exhaust port located on one of sidewalls of the case 150 for exhausting the deposition gas. The case 150 has an opening facing the substrate 200 passing through the deposition chamber 100 inside the heating furnace 120. The deposition gas flows from the spray mechanism toward the exhaust port through the opening in the deposition chamber 100. The opening has a width 1.15-1.4 times larger than that of the substrate 200 in a direction perpendicular to the conveying direction of the substrate 200 passing therethrough face to face. <P>COPYRIGHT: (C)2013,JPO&INPIT |
