| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in the flowability of the composition and having high moisture-resistant reliability and high flame retardancy, to provide its cured product, and to provide a semiconductor-sealing material using the composition. <P>SOLUTION: The thermosetting resin composition includes a compound represented by general formula (I) (wherein, G; hydroxy, glycidyloxy, X; a direct bond, oxygen atom, R; a hydrogen atom, 1-10C alkyl, alkoxy, aryl, aralkyl, a halogen atom, j and k; each an integer of 1-4; n; 0 or 1; R'; naphthylmethyl, antonyl methyl, m; an integer of 1-4). <P>COPYRIGHT: (C)2013,JPO&INPIT |
