| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the height and the cost of a power conversion apparatus, and to increase a ratio of the maximum amount of power to be converted to the cubic volume of the power conversion apparatus. <P>SOLUTION: A plurality of power semiconductor modules 300 are inserted from a side face into a passage forming body 12 which is formed in shape of a substantially rectangular parallelepiped, with a smoothing capacitor module 500 fixed to the underside, while a first AC bus bar 801 and further a circuit board 20 fixed to the top face of the passage forming body 12, respectively, in which way a module is fabricated. This construction helps to reduce the height of the constituent components, making it possible to improve production assemblability and reduce costs. <P>COPYRIGHT: (C)2013,JPO&INPIT |
