发明名称 WAFER EXTENSION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To sufficiently extend all division lines when the number of division lines constituting a wafer differs in a vertical direction and a lateral direction and when extension of partial division lines becomes insufficient. <P>SOLUTION: A wafer extension device 1 for extending the wafer W held by a frame F via an adhesive tape T in a face direction includes: frame holding means 2 for holding the frame F; and push-up means 30a to 30d for extending the adhesive tape T. The push-up means 30a to 30d are arranged in a ring shape divided into at least four, and they include push-up amount control means 32a to 32d for individually controlling heights of the respective push-up means. Since push-up height can be varied, a tape extension amount in a desired direction is adjusted and thus the extension amount of the wafer W is controlled at every direction. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013026544(A) 申请公布日期 2013.02.04
申请号 JP20110161879 申请日期 2011.07.25
申请人 DISCO ABRASIVE SYST LTD 发明人 YOKOYAMA JUNKI
分类号 H01L21/301 主分类号 H01L21/301
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