| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-quality semiconductor device. <P>SOLUTION: A semiconductor storage device 1 is provided with: a memory chip 210 that includes a memory circuit; and a controller chip 310 that controls the memory chip 210. A memory card 1 comprises: a circuit board 300 that has first and second surfaces which are opposed to each other and has a controller chip 310 mounted on the first surface; and a first wiring 325 that is formed on the first surface of the circuit board 300. In addition, the memory card 1 is provided with: a first wire 320, whose one end is connected to the memory chip 210 and whose another end is connected to the first wiring 325; and a second wire 340 whose one end is connected to the controller chip 310 and whose another end is connected to the first wiring 325. Further, the memory card 1 is connected with the first wiring 325 and is provided with a conductive through-hole part 330 that penetrates the first and second surfaces of the circuit board 300. <P>COPYRIGHT: (C)2013,JPO&INPIT |
