发明名称 |
PRINTED WIRING BOARD, PRINTED WIRING BOARD MODULE, OPTICAL COMMUNICATION MODULE, OPTICAL COMMUNICATION DEVICE AND ARITHMETIC PROCESSING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board suppressing unexpected reduction of impedance if position deviation between a layer having a signal conductor and a GND plane layer occurs. <P>SOLUTION: The printed wiring board includes: a signal conductor 11 including a heating terminal 11c electrically connected to a rigid substrate 2, a wiring portion 11b having a narrower width than the heating terminal 11c, and a connection portion 11a connected to the heating terminal 11c and to the wiring portion 11b and having a gradually varying width; and a GND plane layer, which is a layer other than a layer having the formed wiring portion 11b, having a formed GND conductor 15 and including a hollow 17 produced by hollowing the GND conductor 15 at a portion corresponding to the connection portion 11a and the heating terminal 11c. A distance from a boundary portion between the connection portion 11a and the wiring portion 11b to the GND conductor 15 in the horizontal direction is equal to or greater than the thickness of a dielectric between the GND plane layer and the signal conductor 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013026601(A) |
申请公布日期 |
2013.02.04 |
申请号 |
JP20110163181 |
申请日期 |
2011.07.26 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
YAMAGISHI KEITARO;KAMIUMA HIROTAKA |
分类号 |
H05K1/02;H05K1/11;H05K1/14 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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