发明名称 RESIN SEALING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly reliable resin sealing device which can carry out a stable resin molding even at a low resin molding pressure. <P>SOLUTION: A resin sealing device 100 for sealing a workpiece with resin comprises: a mold at one side (upper mold 12) which presses a workpiece from one side; a mold at the other side (lower mold 22) which presses the workpiece from the other side; a plunger 23 which delivers molten resin with pressure when the mold at one side and the mold at the other side clamp the workpiece for sealing the workpiece with resin; a transfer mechanism (multiple transfer unit 24) configured to be able to slide the plunger 23 along a pot 21 arranged on either the mold at one side or the mold at the other side; a load cell 30 for measuring a resin molding pressure which is applied to the plunger 23 by the transfer mechanism; and a load cell amplifier 56 for adding a first prescribed pressure &alpha; to amplify the resin molding pressure which is measured by the load cell 30. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013026360(A) 申请公布日期 2013.02.04
申请号 JP20110158526 申请日期 2011.07.20
申请人 APIC YAMADA CORP 发明人 TAKEUCHI KAZUYA;TAKAHASHI HARUHISA
分类号 H01L21/56;B29C45/03;B29C45/14;B29C45/76 主分类号 H01L21/56
代理机构 代理人
主权项
地址