MODULE FOR ATTACHING LED, LED MODULE, FABRICATING METHOD OF MODULE FOR ATTACHING LED AND FABRICATING METHOD OF LED MODULE

摘要

PURPOSE: A module for attaching a semiconductor light emitting device and a manufacturing method thereof, a semiconductor light emitting device module and a manufacturing method thereof are provided to prevent a short circuit due to a conductive member by coating a terminal part. CONSTITUTION: A conduction board(17) is made of metal having a contact surface. The conduction board is surrounded by a carrier part(18A,18B) and a carrier connection unit(19A). A first surface insulation part includes connection units(20A,20B,20C) and an LED inserting part(36). An exposure hole is formed on the inner side of the LED inserting part. A terminal insulation part(43) is installed at the front-end of the first surface insulation part. A connection recess part is formed in the upper side of the terminal insulation part. [Reference numerals] (AA) Up; (BB) Back; (CC) Right; (DD) Down; (EE) Front; (FF) Left