| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents a short-circuit between two electrodes of a surface-mounted component, thereby soldering the surface-mounted component to a metal pattern. <P>SOLUTION: A semiconductor device according to the present invention includes: a substrate; a first metal pattern that is formed on the substrate; a second metal pattern that is formed on the substrate; a surface-mounted component in which a first electrode is formed at one end and a second electrode is formed at the other end; first solder that fixes the first electrode to the first metal pattern; second solder that fixes the second electrode to the second metal pattern; and molding resin that covers the surface-mounted component and has trenches formed so as to sandwich the surface-mounted component from the outside of the first electrode and the outside of the second electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT |
