发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To precisely monitor a manufacturing process of a semiconductor device. <P>SOLUTION: An output waveform of a third sensor is formed from a waveform A1 which corresponds to a dynamic range of the sensor by a process according to a recipe. After that, a substrate is processed according to the recipe so that a waveform A2 caused by the process is formed. The waveform A2 is a signal having a noise level. By normalizing the output waveform of the third sensor, a signal at a noise level is prevented from being amplified. An operational state of a semiconductor manufacturing apparatus is monitored by performing multivariate analysis using data provided by normalizing output waveforms of a first sensor, a second sensor, and the third sensor, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013026503(A) 申请公布日期 2013.02.04
申请号 JP20110161024 申请日期 2011.07.22
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 TSUCHITANI TAKAHIRO
分类号 H01L21/3065;C23C14/34;H01L21/304;H01L21/31 主分类号 H01L21/3065
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