| 摘要 |
<P>PROBLEM TO BE SOLVED: To tilt a pressure body in parallel to a mounting stage that supports a substrate when mounting a semiconductor chip on the substrate by the pressure body provided on a mounting head. <P>SOLUTION: An electronic component mounting device comprises: a mounting head 11 that is vertically driven; a pressure body 14 that is provided on the underside of the mounting head so as to be elastically displaced by elastic support means 13 and that sucks and holds a semiconductor chip by a suction part 25b; and a pressure body drive source that drives the mounting head in the descending direction so as to mount the semiconductor chip, which is sucked and held by the suction part of the pressure body, on a substrate. The elastic support means is constituted by: a movable block body 16 that has two pairs of side surfaces opposed to each other in parallel and is arranged between the mounting head and the pressure body; first coupling bodies 21 that couple one ends of a pair of coupling spring bodies 17 whose other ends are mounted on one pair of side surfaces of the movable block body, to the mounting head; and second coupling bodies 22 that couple one ends of the pair of coupling spring bodies whose other ends are mounted on the other pair of side surfaces of the movable block body, to the pressure body. <P>COPYRIGHT: (C)2013,JPO&INPIT |
