发明名称 STAGE DEVICE AND PROCESS DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique capable of controlling a thickness distribution of a function material layer with high precision and in a short period of time. <P>SOLUTION: A stage device according to an embodiment comprises: a height control unit 12 arranged on a lower surface side of a substrate 13 to be processed and including a plurality of height control elements which are vertically driven; and a control unit 15 which controls the height control unit 12. The control unit 15 divides an upper surface of the substrate 13 to be processed into a plurality of areas, and sets a height of each of the areas independently by controlling a height of each of a plurality of height control elements on the basis of a data value. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013026233(A) 申请公布日期 2013.02.04
申请号 JP20110156005 申请日期 2011.07.14
申请人 TOSHIBA CORP 发明人 INENAMI RYOICHI;ITO SHINICHI;KOIZUMI HIROSHI;KOJIMA AKIHIRO
分类号 H01L21/683;H01L21/027;H01L21/205;H01L21/31 主分类号 H01L21/683
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