| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a cooler which is fixed to a semiconductor package without being deformed during manufacturing processes, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device of this invention includes: multiple cooling pipes 2 having coolant passages therein; semiconductor packages 1, each of which is fixed to one main surface of each cooling pipe 2; seal spacer parts (protruding parts 2a) for stacking the multiple cooling pipes 2 as a shelf like cooling structure, in which the multiple cooling pipes 2 are spaced away from each other, and maintaining the airtightness at end parts of the cooling structure; headers (an inlet side header 3, an outlet side header 4) respectively provided at one end and the other end of the cooling structure and each of which has one opening that is used for taking in/out a coolant to/from the respective cooling pipes 2 and is connected with the seal spacer parts in a hermetic manner. <P>COPYRIGHT: (C)2013,JPO&INPIT |
