| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for reducing particles migrating into a vertical heat treatment furnace and suppressing adhesion of the particles to a substrate (wafer). <P>SOLUTION: In an apparatus for heat treatment, a wafer boat 3 is carried into a vertical heat treatment furnace 2 from a throat 20 formed at a lower side of the heat treatment furnace. The apparatus includes a lid 61 for capping the throat 20 when the wafer boat 3 is positioned below the heat treatment furnace 2. The lid 61 is movable between a position for capping the throat 20 and a position for opening the throat 20. When the lid 61 is dislocated from the position capping the throat 20, the particles on an upper face of the lid 61 are sucked and removed by a cleaning nozzle 7. Since an amount of particles carried into the heat treatment furnace 2 can be reduced when the lid 61 caps the throat 20 in the next time, adhesion of the particles to a wafer can be suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
