| 摘要 |
<P>PROBLEM TO BE SOLVED: To satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of plating baths. <P>SOLUTION: A new imidazole ring-bonded type oxyalkylene compound includes an oxyalkylene chain selected from 2 to 4C alkylene, wherein an imidazole ring is bonded to the oxyalkylene chain through nitrogen atom at the third position and located at the terminal. When the oxyalkylene compound is used for various kinds of plating baths, foaming property is dominantly reduced while satisfactorily maintaining water solubility by introducing an imidazole ring group to the terminal in comparison with a conventional nonionic surfactant. When the oxyalkylene compound, in which an imidazole ring group exists in the molecule of a nonionic surfactant, is used for a copper plating bath for example, both of the action of the surfactant and leveling action are provided, and the plating solutions are easily managed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
