| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper bonding wire having high tensile strength and elongation and small rigidity. <P>SOLUTION: The copper bonding wire consists of a soft thin copper alloy material which includes an additive element selected from a group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr and whose remainder is copper and inevitable impurity. In a crystalline structure, an average crystal particle size to depth which is 20% of a wire diameter from at least a surface to an inner part is 20 μm or below. <P>COPYRIGHT: (C)2013,JPO&INPIT |
