| 发明名称 |
ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of capturing cations entering from the outside in a production process of a semiconductor device and preventing reduction in electric characteristics of the semiconductor device to be produced to improve product reliability. <P>SOLUTION: The adhesive sheet includes components (a)-(c): (a) an acrylic resin with the weight average molecular weight of 800,000 or higher; (b) at least one of an epoxy resin and a phenol resin; and (c) a complexing agent forming a complex with metallic ion. The adhesive sheet is composed of organic components alone. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013023685(A) |
申请公布日期 |
2013.02.04 |
| 申请号 |
JP20110163385 |
申请日期 |
2011.07.26 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
KIMURA TAKEHIRO;ONISHI KENJI |
| 分类号 |
C09J133/00;C09J7/00;C09J11/06;C09J161/04;C09J163/00;H01L21/52 |
主分类号 |
C09J133/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
