| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulation laminate material capable of minimizing the occurrence of cracking in a dielectric plate during thermal cycle and the occurrence of peeling on the bonding interface of the dielectric plate and a second metal plate. <P>SOLUTION: The insulation laminate material becoming an insulation circuit board 4 of a base for power module consists of a dielectric plate 5, a circuit board 6 bonded to one surface of the dielectric plate 5 with a heating element being attached to the surface on the opposite side of the dielectric plate 5, and a stress relief plate 7 bonded to the other surface of the dielectric plate 5. The circuit board 6 and the stress relief plate 7 are rectangular, and the whole contour of the stress relief plate 7 is located on the inside of the circuit board 6. Effectively, the relation is satisfied: 0<L2/L1≤0.035, where the distance between the center O of the circuit board 6 and each corner C represents L1 and the distance between each corner C of the circuit board 6 and the corner C1 of the stress relief plate 7 closest thereto represents L2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
