| 摘要 |
A driving chip package, a display device including the same, and a method of testing the driving chip package are disclosed. Any contact failure between the driving chip package and the display substrate can be easily detected, thus reducing the quality management cost and preventing additional failures and increasing the manufacturing yield. The driving chip package includes a base film made of an insulating material, a plurality of interconnection lines formed (e.g., patterned) on the base film (that conduct externally processed driving signals to driving chip and that conduct the driving signals processed in and output by the driving chip), and at least one test interconnection line (e.g., a test signal input interconnection line or a test signal output interconnection line) formed parallel to the interconnection lines on the base film. A test signal input interconnection line and a corresponding test signal output interconnection line are electrically connected through a link on the display substrate. |
