| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an addition curing-type silicone adhesive composition that enables to attain adhesion even after short time curing at room temperature, and to provide a bonding procedure for the same. <P>SOLUTION: The addition curing-type silicone adhesive composition includes (A) an organopolysiloxane containing a silicon atom-bonded alkenyl group represented by formula (1): R<SP POS="POST">1</SP><SB POS="POST">a</SB>R<SP POS="POST">2</SP><SB POS="POST">b</SB>SiO<SB POS="POST">(4-a-b)/2</SB>, wherein R<SP POS="POST">1</SP>is Vi, R<SP POS="POST">2</SP>is an univalent hydrocarbon group that does not contain an aliphatic unsaturated bond, 0<a≤2, 0.5≤b<3 and 0.8<a+b≤3, (B) an organo hydrogen polysiloxane containing a silicon atom-bonded hydrogen group represented by formula (2): H<SB POS="POST">c</SB>R<SP POS="POST">3</SP><SB POS="POST">d</SB>SiO<SB POS="POST">(4-c-d)/2</SB>, wherein R<SP POS="POST">3</SP>is an univalent hydrocarbon group that does not contain aliphatic unsaturated bond, 0<c<2, 0.8≤d≤2, and 0.8<c+d≤3, (C) a silane compound containing an aromatic group and an alkenyl group, (D) an addition reaction catalyst, (E) a compound having an alkenyl group or (meth)acryl group and containing either one of alkoxy, carbonyl, epoxy and alkoxysilyl group. <P>COPYRIGHT: (C)2013,JPO&INPIT |
