| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology of manufacturing a carrier plate for miniaturized chip elements, in which a hole having a size smaller than the overall thickness of a metal plate can be formed, with a simple structure. <P>SOLUTION: When forming a first hole 220 for inserting a chip in a metal thin plate, a carrier plate assembly is manufactured by a system of bonding a large number of metal thin plates having a thickness that is remarkably smaller than the size of a hole to be formed. A diffusion bonding system of applying a high pressure in a high temperature vacuum atmosphere, a diffusion bonding system of adding a bonding catalyst agent softer than the base metal, i.e., the metal thin plate, or a system of bonding with an adhesive for metal bonding is utilized as the bonding system. <P>COPYRIGHT: (C)2013,JPO&INPIT |
