发明名称 Power Semiconductor Chip Having Two Metal Layers on One Face
摘要 A semiconductor chip includes a power transistor circuit with a plurality of active transistor cells. A first load electrode and a control electrode are arranged on a first face of the semiconductor chip, wherein the first load electrode includes a first metal layer. A second load electrode is arranged on a second face of the semiconductor chip. A second metal layer is arranged over the first metal layer, wherein the second metal layer is electrically insulated from the power transistor circuit and the second metal layer is arranged over an area of the power transistor circuit that comprises at least one of the plurality of active transistor cells.
申请公布号 US2013027113(A1) 申请公布日期 2013.01.31
申请号 US201113191891 申请日期 2011.07.27
申请人 INFINEON TECHNOLOGIES AG;OTREMBA RALF;HOEGLAUER JOSEF;SCHREDL JUERGEN;SCHLOEGEL XAVER 发明人 OTREMBA RALF;HOEGLAUER JOSEF;SCHREDL JUERGEN;SCHLOEGEL XAVER
分类号 H03K17/56;H01L21/98;H01L23/538;H01L25/07 主分类号 H03K17/56
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