LED PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed are an LED package having a heat slug and superior heat-dissipation efficiency, and a method for manufacturing same. The LED package is characterized by comprising: a lead frame for receiving a power supply; an LED chip electrically connected to the lead frame; a heat slug, which has a mounting portion onto which the LED chip is mounted, for dissipating heat generated in the LED chip to the outside; and a body portion enclosing at least a portion of the outer periphery of the heat slug, wherein an outer region of at least a portion of the body portion has greater heat resistance than the inner region thereof. Further, the method for manufacturing the LED package is characterized by comprising: a body portion forming step of forming the body portion that accommodates therein a portion of the lead frame and a portion of the heat slug, wherein the body portion is formed such that an outer region of at least a portion thereof has greater heat resistance than the inner region thereof; and a step of mounting an LED chip on a mounting portion provided on the upper surface of the heat slug, and then electrically connecting the LED chip to terminals of the lead frame. According to the LED package and the method for manufacturing same, the effects of high extraction efficiency for light emitted from the LED chip and superior thermal stability can be obtained.