发明名称 Circuit Structures, Memory Circuitry, And Methods
摘要 A circuit structure includes a substrate having an array region and a peripheral region. The substrate in the array and peripheral regions includes insulator material over first semiconductor material, conductive material over the insulator material, and second semiconductor material over the conductive material. The array region includes vertical circuit devices which include the second semiconductor material. The peripheral region includes horizontal circuit devices which include the second semiconductor material. The horizontal circuit devices in the peripheral region individually have a floating body which includes the second semiconductor material. The conductive material in the peripheral region is under and electrically coupled to the second semiconductor material of the floating bodies. Conductive straps in the array region are under the vertical circuit devices. The conductive straps include the conductive material and individually are electrically coupled to a plurality of the vertical circuit devices in the array region. Other implementations are disclosed.
申请公布号 US2013026471(A1) 申请公布日期 2013.01.31
申请号 US201113191293 申请日期 2011.07.26
申请人 ZAHURAK JOHN K.;TANG SANH D.;HEINECK LARS P.;ROBERTS MARTIN C.;MUELLER WOLFGANG;LIU HAITAO 发明人 ZAHURAK JOHN K.;TANG SANH D.;HEINECK LARS P.;ROBERTS MARTIN C.;MUELLER WOLFGANG;LIU HAITAO
分类号 H01L29/786;H01L21/20;H01L27/08;H01L27/108 主分类号 H01L29/786
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