发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses increases in physical size and cost. <P>SOLUTION: A semiconductor device comprises: two unit circuits series connected between a DC power supply and a ground; a control part controlling the unit circuits; and an inductive load connected to a midpoint of the two unit circuits. Each of the two unit circuits includes: a first switch element; a reflux diode inverse-parallel connected with the first switch element; and a bypass part parallel connected with the reflux diode and parallel connected with the first switch element. The bypass part includes a series connected second switch element and a resistance. The control part turns one of the first switch elements of the two unit circuits to be in an ON-state in one period and then turns the other first switch element to be in the ON-state in the next period across a dead period during which the control part turns the two first switch elements to be in an OFF state. During the dead period, the control part turns the second switch element parallel connected with the one first switch element to be in an ON-state until the other first switch element shifts from the OFF-state to the ON-state. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013021670(A) 申请公布日期 2013.01.31
申请号 JP20120036551 申请日期 2012.02.22
申请人 DENSO CORP 发明人 KOBAYASHI ATSUSHI
分类号 H03K17/695;H02M3/155;H03K17/16;H03K17/687 主分类号 H03K17/695
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