发明名称 SOLID-STATE IMAGE SENSOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state image sensor in which the signal charges of a photoelectric conversion region can be read entirely regardless of the depth position of a semiconductor substrate, and thereby the imaging characteristics are enhanced while eliminating the afterimage. <P>SOLUTION: The solid-state image sensor includes a read gate 21r buried in a trench 17R formed in a semiconductor substrate 13 via a gate insulator 19, and a photoelectric conversion region 15r provided in the semiconductor substrate 13. Furthermore, a floating diffusion 23 is provided in the surface layer of the semiconductor substrate 13 while keeping an interval between the photoelectric conversion region 15r. In particular, a potential adjustment region 25r is provided in contact with the photoelectric conversion region 15r and the gate insulator 19. The potential adjustment region 25r has the same conductivity type as that of the semiconductor substrate 13 and the photoelectric conversion region 15r, and is an impurity region having the concentration of conductivity type lower than that of the semiconductor substrate 13 and the photoelectric conversion region 15r. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013021169(A) 申请公布日期 2013.01.31
申请号 JP20110153914 申请日期 2011.07.12
申请人 SONY CORP 发明人 ENOMOTO TAKAYUKI;TOGASHI HIDEAKI
分类号 H01L27/146;H01L31/10;H04N5/374 主分类号 H01L27/146
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