| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate type semiconductor package which improves the manufacturing yield as a package while maintaining a package structure that is thin and excellent in assemblability. <P>SOLUTION: A laminate type semiconductor package 1 according to an embodiment includes first and second modules 6, 7 that are laminated on a wiring board 2. The first and second modules 6, 7 respectively include multiple semiconductor chips 9, 14 which are mounted on interposers 8, 13. Further, the first and second modules 6, 7 respectively include the sealing resin layers 11, 16. The interposer 8 and the wiring board 2 are electrically connected by a metal wire, a printed wiring layer, or a metal bump. The interposer 13 and the wiring board 2 are electrically connected by a metal wire or a printed wiring layer. The first and second modules 6, 7 are sealed with a third sealing resin layer 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
