| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a panel heating device that can efficiently transfer the heat of a heating medium to a floor surface. <P>SOLUTION: The panel heating device 1 comprising a pipe 3 through which the heating medium flows, a panel 2 having a groove 20 for pipe arrangement where the pipe is arranged formed at the upper surface thereof, and a surface heat equalizing plate 4 formed of metal and arranged on the upper surface of the panel, and characterized by a plurality of high heat conducting sheets 5 comprising a material of higher heat conductivity than the surface heat equalizing plate arranged between the panel and the surface heat equalizing plate, and the high heat conducting sheets having at least one end thereof connected to the pipe and arranged in a direction orthogonal to the pipe arrangement direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
