| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition which allows for formation of a highly reliable void-free underfill while facilitating the positioning of a solder bump, and to provide a semiconductor device using the same. <P>SOLUTION: The liquid wafer-level underfill agent composition which coagulates during the B-stage process in order to create a smooth and non-adhesive surface on a silicon wafer and capable of supporting the B-stage contains (A) a cresol novolak-type epoxy resin, (B) a phenol novolak resin, (C) a 2-phenyl-4,5-dihydroxy methyl imidazole, (D) an organic solvent and (E) a zirconium oxide. <P>COPYRIGHT: (C)2013,JPO&INPIT |
