| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can radiate heat generated at a semiconductor element to the outside with a simple configuration and further with high efficiency, and provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device 10 comprises a metal plate 12 with one principal surface 12p exposed to ambient air; an insulation layer 14 formed on another principal surface 12q of the metal plate 12 and composed of a high thermal conductivity insulating resin; a conductor pattern 16 formed on the insulation layer 14; a semiconductor element 20 mounted on the conductor pattern 16; lead pins 22 connected to the conductor pattern 16; and a resin part 24 covering the other principal surface 12q side of the metal plate 12. <P>COPYRIGHT: (C)2013,JPO&INPIT |
