| 摘要 |
PURPOSE: An interconnection wiring method and a mounted solenoid manufacturing method using the same are provided to reduce production costs by omitting a chemical mechanical polishing process and simplifying a manufacturing process. CONSTITUTION: A plurality of via holes(15) is formed in a substrate(10) into a matrix type. An insulating layer(20) is formed in the substrate in which the via hole is formed. A metallic thin film(30) is formed in the via hole using patterning. A mask pattern is formed in a domain except for the via hole using a photograph process. The metallic thin film is evaporated on the substrate which is pattern. The mask pattern is etched. A solder ball(40) is located on the upper side of the via hole. The solder ball is filled in the via hole by heating. |
