| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably support and transfer a wafer, having a thin plate shape, without causing handling errors to the wafer and thereby ensuring to conduct an electric characteristic inspection of a device easily. <P>SOLUTION: An adhesive tape 72 is applied to a surface of a wafer 73, and a dicing frame 71 is formed so as to be transferred while keeping the wafer 73 on the dicing frame 71. In the case, the adhesive tape 72 is applied to a pattern formation surface 74 side of the wafer 73 and is peeled so that an outer edge part of the wafer 73 remains to expose the pattern formation surface 74. Further, pre-cut lines 75 for peeling are formed on the adhesive tape 72 and the adhesive tape 72 is easily peeled along the pre-cut lines 75. <P>COPYRIGHT: (C)2013,JPO&INPIT |
