| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly-accurate, highly-reliable semiconductor device, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor device has: a substrate 10 having a first principal surface and a second principal surface opposite to the first principal surface; a semiconductor chip 20 mounted on the first principal surface of the substrate 10; a resin 40 encapsulating the semiconductor chip 20; a solder ball 30 arranged on the first principal surface of the substrate 10, and at least a part of which is exposed from the resin 40 by removing a part of the resin 40 by laser processing; and a solder ball 50 arranged on the second principal surface of the substrate 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
