| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer grinding method capable of flattening a rear surface of a wafer by rear-surface grinding even when a bump is formed on the wafer. <P>SOLUTION: A grinding method for grinding a rear surface of a wafer 11 having a bump formation region in which a plurality of bumps 17 are formed on its surface comprises: a protective tape sticking step of sticking a protective tape 23, in which an adhesive material layer having a thickness higher than the bump is formed on an upper surface of a base film, to a surface of the wafer so that the bump is embedded in the adhesive material layer; a protective tape grinding step of forming a flat surface by grinding the whole surface of the base film of the protective tape stuck to the surface of the wafer with a byte tool 28 in a range in which the base film does not reach the adhesive material layer; and a rear surface grinding step of thinning the wafer to a prescribed thickness by grinding the rear surface of the wafer with grinding means with the surface of the wafer to which the protective tape was stuck being retained in a chuck table of a grinding device via the protective tape. <P>COPYRIGHT: (C)2013,JPO&INPIT |
