发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS |
摘要 |
A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.
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申请公布号 |
US2013026640(A1) |
申请公布日期 |
2013.01.31 |
申请号 |
US201213624324 |
申请日期 |
2012.09.21 |
申请人 |
SEIKO EPSON CORPORATION;SEIKO EPSON CORPORATION |
发明人 |
ITO HARUKI;HASHIMOTO NOBUAKI |
分类号 |
H01L23/528 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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