METHOD FOR PRODUCING A LIGHT-EMITTING SEMICONDUCTOR COMPONENT, AND LIGHT-EMITTING SEMICONDUCTOR COMPONENT

摘要

A method for producing a light-emitting semiconductor component is specified, wherein a light-emitting semiconductor chip (2) is arranged on a mounting area (10) of a carrier (1), wherein the semiconductor chip (2) is electrically connected to electrical contact regions (11, 12) on the mounting area (10), and wherein an encapsulation layer (3) is applied to the semiconductor chip (2) by means of atomic layer deposition, wherein all surfaces of the semiconductor chip (2) which are free after mounting and electrical connection are covered with an encapsulation layer (3). Furthermore, a light-emitting semiconductor component is specified.